CJT Semiconductors & Components on ICGOODFIND SiteMap
最新文章
- ST’s New Automotive StripFET F8 MOSFET – 0.59mΩ RDS(on) for High‑Density Power
- DRAM Shortage Traps $1B Apple A20 Pro Chips at TSMC – Packaging Stalled
- China's MEMS Mirror Leader Zhixin Sensor Secures State-Backed Funding – OCS Optical Switching Heats Up
- Foxconn July Revenue Breaks NT$900B – AI Servers Fuel Historic High
- U.S. Plans Polysilicon Price Floor and Tariffs Under Section 232 – Targeting Semiconductor & Solar Supply Chains
- Memory Prices Hit All-Time Highs in July – Q3 Contract Hikes Slow to 15-20%
- AMEC Targets 60% of High-End Semiconductor Equipment Coverage in 5 Years – Aims for Top Tier by 2035
- Toshiba Rolls Out 40V 120A MOSFET in S-TOGL Package – Low 1.54mΩ RDS(on) for 12V Automotive Systems
- U.S. Awards GlobalFoundries $300M for Silicon Photonics R&D – CPO Push for AI Data Centers
- Acrab Unveils 5nm Edge AI Chip Gelix 1 – 700 TOPS, Runs 100B-Parameter LLMs Locally
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Microchip Acquires Edge AI Chip Firm Hailo – Adds Vision SoCs & AI Accelerators
- STMicro Q2 Revenue Tops $3.49B – AI Data Center Orders Fuel H2 Outlook
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- CXMT LPDDR6 Samples First – 12.8Gbps, Targeting H2 2026 Mass Production
- 3PEAK TPAFEA108 AFE Chip for Optical Modules – 4-Channel IDAC + VDAC with Adaptive Power
- China’s Logic Chips Reach 5nm-Class Performance via DUV Multipatterning, Says SMIC Co-Founder Xie Zhifeng
- China’s First Glass-Substrate CoPoS AI Chip Package Debuts – Xianfeng & Enflame Joint Demo
- PTI & Broadcom Form Singapore JV for Panel-Level Advanced Packaging
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- Micron Expands 1γ LPDDR5X Lineup with 6GB, 12GB, 24GB Non-Binary Options
- TSMC to Hike Mature-Node Wafer Prices – First Adjustment in 3 Years
- China’s AI Hardware Trade Hits RMB 5.13 Trillion in H1 2026 – Up 56.6% YoY
- Muxi Shares Hit RMB 1,000 Then Deny Order Rumors – GPU Unicorn Still Unprofitable
- AMD Confirms Zen 6 Launch at Advancing AI 2026 – July 22-23
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- Lithium Battery and Radar Pioneers Win China’s Top Science Award
- Samsung Lands Neuralink Chip Order – Expands Musk Partnership into Biochips
- onsemi NSS12201LT1G: High-Performance P-Channel MOSFET for Power Management Applications
- Onsemi FDMS86105 PowerTrench MOSFET: Advanced Performance for High-Efficiency Power Conversion
- onsemi FGA180N33ATDTU 330V N-Channel Power MOSFET Datasheet and Application Overview
- onsemi NVMFD5C650NLT1G 80V N-Channel Power MOSFET Datasheet and Application Overview
- onsemi MC33269DTG 0 A Low Dropout Voltage Regulator: Datasheet, Pinout, and Application Circuit Guide
- MC33178DMR2G Low-Noise Operational Amplifier: Features and Applications
- onsemi FSA553UCX: Advanced USB-C Port Protection and Charging Solution
- onsemi 1N5355BG Zener Diode: Key Specifications and Application Circuit Design
- Kioxia & SanDisk Ship BiCS10 332-Layer 3D NAND Samples – 59% Density Jump
- ZTE Microelectronics Invests RMB 100M to Establish Nanjing Semiconductor Subsidiary
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Etched Solves AI Throttling with Low-Voltage Design – SRAM+HBM, 80%+ Utilization on Sparse MoE
- Tata Electronics Hit by 630GB Cyber Breach – Apple & Tesla Blueprints Dumped on Dark Web
- onsemi to Acquire Synaptics in $7B All‑Stock Deal, Expanding Edge AI Footprint
- TI Launches Integrated GaN Buck‑Boost Converters for High‑Power Density
- China’s Largest Automotive Chip Test Center Launches in Shanghai Lingang
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Micron and Anthropic Forge AI Infrastructure Partnership Across HBM, DRAM, and Equity
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Intel and AMD Unite on ACE AI Compute Extension, Boosting x86 AI Performance Up to 16x
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- NXP’s SAF8444 Single‑Chip Radar Brings ADAS to Entry‑Level EVs
- Li Auto’s Mach M100 Dataflow Chip Hits 1280 TOPS, Outperforms Nvidia ThorU
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
- Jiangbolong VP Files for $31M Stock Sale After 840% Rally – Second Stake Reduction
- China GPU ‘Four Dragons’ Member Enflame Nears STAR Market IPO Hearing, Targets $825M Raise
- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- Shenzhen University Launches Integrated Circuit School to Boost Chip Talent Pipeline
- Broadcom Q2 Net Income Soars 87.5% to $9.31B, AI Revenue Up 143%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- NXP CBTL06DP213EE: A 6-Channel High-Speed Differential Switch for Advanced System Design
- NXP BC869: A Comprehensive Overview of its Architecture and Target Applications
- NXP TDA10024HN: A Comprehensive Technical Overview of a Legacy DVB-C Demodulator
- NXP 74LVC32AD: A Comprehensive Technical Overview of the Low-Voltage Quad 2-Input OR Gate IC
- NXP MKL13Z64VLK4: An Ultra-Low-Power ARM Cortex-M0+ MCU for Space-Constrained Embedded Applications
- NXP UJA1162ATK/0Z: A Comprehensive System Basis Chip for Automotive Networking Applications
- Unveiling the NXP 74AHC1G07GW: A Single Buffer Gate with Open-Drain Output
- NXP S912XEQ512F1MAG: A High-Performance 32-bit Automotive Microcontroller for Next-Generation Vehicle Systems
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP SPC5534MVZ80R: A High-Performance 32-Bit Microcontroller for Advanced Automotive and Industrial Applications
- NXP TEF6635HW/V106ZK: A Comprehensive Technical Overview of its Architecture and Automotive Applications
- NXP SL2S2602FUD/BGZ: A Secure Authenticator for Next-Generation IoT and Smart City Applications
- NXP SPC5517EBMLQ66 32-Bit Microcontroller for Automotive Body and Chassis Applications
- NXP T1024NXN7MQA: A Comprehensive Technical Overview of QorIQ's Power Architecture System-on-Chip
- NXP S9S08SG32E1MTJ: A Comprehensive Technical Overview of the 8-bit HCS08 Microcontroller
- NXP PUMB1: A Comprehensive Technical Overview of the Advanced Power Management IC
- NXP TDA5140AT: A Comprehensive Technical Overview of the Brushless DC Motor Controller
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- NXP S912ZVML64F3WKH: A High-Performance 32-bit Automotive Microcontroller for Advanced Body Control and Gateway Applications
- NXP PHPT61003PY: A Comprehensive Technical Overview of the High-Performance 32-bit Microcontroller
- NXP 74HC164BQ: An 8-Bit Serial-In, Parallel-Out Shift Register for Digital Logic Applications
- NXP PN5482D2EV/C2100A1: A Comprehensive Technical Overview of the NFC Controller
- NXP SP5742PFK1AMLQ9R: A High-Performance 32-Bit Automotive Microcontroller for Safety-Critical Applications
- The HEF4043BP Quad R/S Latch: A Comprehensive Guide to NXP's CMOS Logic IC
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP 74LVC1G332GW: A Single 3-Input OR Gate for Advanced Low-Voltage Digital Design
- NXP BYV25FD-600: A High-Performance Ultrafast Rectifier Diode for Power Conversion Applications
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More