Infineon IRFS31N20DTRLP 200V 31A HEXFET Power MOSFET in a D2PAK (TO-263) Package

Release date:2025-10-29 Number of clicks:163

Harnessing High Power with Precision: The Infineon IRFS31N20DTRLP HEXFET Power MOSFET

In the realm of power electronics, efficiency, reliability, and thermal performance are paramount. The Infineon IRFS31N20DTRLP stands as a formidable solution, engineered to meet the rigorous demands of high-power applications. This 200V, 31A N-channel HEXFET Power MOSFET, housed in the robust D2PAK (TO-263) package, is designed to deliver exceptional switching performance and low on-state resistance.

At the heart of this device is Infineon's advanced HEXFET technology, which provides very low typical RDS(on) of just 19.5 mΩ. This ultra-low resistance is critical for minimizing conduction losses, leading to higher efficiency and reduced heat generation in applications such as switch-mode power supplies (SMPS), motor control systems, and high-current DC-DC converters. The 200V drain-source voltage rating ensures ample headroom for operations in industrial and automotive environments, where voltage spikes and transient conditions are common.

The choice of the D2PAK surface-mount package is a significant advantage. It offers an excellent balance between a compact footprint and superior thermal characteristics. The package's large exposed pad facilitates efficient heat transfer to the PCB, allowing for effective power dissipation without the need for bulky heatsinks in many scenarios. This makes the component ideal for space-constrained designs that cannot compromise on power handling or thermal management.

Furthermore, the MOSFET is characterized by its fast switching speed and robust design, which helps in reducing switching losses and improving overall system efficiency. Its avalanche ruggedness ensures reliability under stressful operating conditions, providing designers with confidence in the longevity of their end products.

ICGOOODFIND: The Infineon IRFS31N20DTRLP is a top-tier component that masterfully combines high current handling, low losses, and excellent thermal performance in a versatile package, making it an indispensable choice for advanced power management solutions.

Keywords: HEXFET Technology, Low RDS(on), D2PAK Package, High Current Handling, Power Management.

Home
TELEPHONE CONSULTATION
Whatsapp
BOM RFQ